TECHSHIP IS A GLOBAL SUPPLIER OF WIRELESS COMPONENTS
This document describes the Huawei RIL (Radio Interface Layer) for Android and the deliveries included. It includes description on how to integrate the RIL and what is supported.
This guide instructs the kernel driver integration development for Huawei modules based on Linux operating system (OS), such as Android, Ubuntu and Chrome OS. It is intended for the driver developers of the products based on Linux kernel OS.
This document mainly describes the power supply design for Huawei modules. This document also provides Huawei modules' requirements for power supplies, which can be used as reference for designing power supplies for Huawei modules. This document is composed of four chapters:
Power Supply Requirements
Power Supply Design Requirements
External Power Supply Circuits
Recommendations for the Layout and Routing of External Power Supply Circuits
This document describes how electrostatic discharge (ESD) occurs, how to conduct ESD tests, how interfering signals resulted from ESD are coupled to circuits of electronic devices, and what rules need to be followed during ESD design for Huawei LGA modules. Following these rules can provide users with good ESD performance during applications of Huawei LGA modules.
This document describes the rules and precautions of designing Printed Circuit Board (PCB) interconnection for the HUAWEI LGA module. By observing the rules, users can ensure the performance of this module in use and reduce costs effectively.
This guide instructs the kernel driver integration development for Huawei Modules based on Embedded Linux & Android operating system. It is intended for the driver developers of the products based on Embedded Linux & Android OS.
This document provides instructions for storage, packing, SMT assembly, and rework of the HUAWEI LGA module, and serves as a guide to secondary assembly of the HUAWEI LGA module. Meanwhile, this document provides PCB design guide for module assembly requirements of producibility and maintainability
The HUAWEI LGA module has two types of packaging:
PCB145-3030M: 145 pin LGA with a dimension of 30 mm × 30 mm
PCB114-3020M: 114 pin LGA with a dimension of 30 mm × 20 mm
The purpose of this document is to describe some hardware specification which is useful to develop a product with HUAWEI LGA module supporting PCM (Pulse- Coded Modulation). This document is intended for HUAWEI customers who are integrators and about to implement their applications by using our module.
The HUAWEI LGA module supports the PCM, which can be used for the module to transmit and receive digital audio data. Linear and μ-law codecs are supported. The HUAWEI LGA module uses the PCM interface as part of the audio front end; it easily allows for an external codec to be used instead of the internal codec. As an example, through the PCM you could connect a HUAWEI LGA module to a Bluetooth device.
The HUAWEI LGA module has one PCM port. Please refer to the Hardware Guide of the module that you are in use to know the PIN number of the PCM ports.
This document briefly describes the power management related connection hardware
between the host and module.
This document is only applicable to the Windows XP/Android system; and is not
applicable to the Windows 7/8/blue system and later systems released by Microsoft
because of their feature (they defines their own sleep, wakeup and remote wakeup
This document describes the brief hardware information of ME909 series module.
This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the ME909 series module.