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This document describes how electrostatic discharge (ESD) occurs, how to conduct ESD tests, how interfering signals resulted from ESD are coupled to circuits of electronic devices, and what rules need to be followed during ESD design for Huawei LGA modules. Following these rules can provide users with good ESD performance during applications of Huawei LGA modules.

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This document describes the rules and precautions of designing Printed Circuit Board (PCB) interconnection for the HUAWEI LGA module. By observing the rules, users can ensure the performance of this module in use and reduce costs effectively.

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This document describes how to use MG323-B together with various development boards.

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Uploaded at
2012-07-02 20:10:16
Last updated
2015-09-30 14:28:21
Version
02
Related products
Huawei MG323-B Rev. V1R1
Huawei MG323-B LCC Development Kit
Huawei MG323-B Rev. V1R3