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This document describes how electrostatic discharge (ESD) occurs, how to conduct ESD tests, how interfering signals resulted from ESD are coupled to circuits of electronic devices, and what rules need to be followed during ESD design for Huawei LGA modules. Following these rules can provide users with good ESD performance during applications of Huawei LGA modules.

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This document describes the rules and precautions of designing Printed Circuit Board (PCB) interconnection for the HUAWEI LGA module. By observing the rules, users can ensure the performance of this module in use and reduce costs effectively.

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This document provides instructions for storage, packing, SMT assembly, and rework of the HUAWEI LGA module, and serves as a guide to secondary assembly of the HUAWEI LGA module. Meanwhile, this document provides PCB design guide for module assembly requirements of producibility and maintainability
The HUAWEI LGA module has two types of packaging:

PCB145-3030M: 145 pin LGA with a dimension of 30 mm × 30 mm
PCB114-3020M: 114 pin LGA with a dimension of 30 mm × 20 mm

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This document describes the Huawei MU739 Developer Board and how to use it during test and evaluation of Huawei MU739.

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Uploaded at
2012-07-02 20:24:29
Last updated
2015-09-24 19:44:04
Version
01
Related products
Huawei MU739
Huawei MU739 LGA Development Kit