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Huawei MU739 Development Kit. Incl. 3 Hours Technical Support

Article Number: 10062
Brand: Huawei
Supplier number: 51076212

The Huawei MU739 Development Kit (DVK) provides a complete solution based on the data functions of the module.
For designers who adopt the module in their design, the DVK facilitates their module- based programming and troubleshooting at the project development stage.
Consisting of a dedicated interface board and accessories, the DVK provides the following interfaces:

5 V power supply input interface
One mini USB port
One standard RS-232 interface: COM1
Standard Subscriber Identity Module (SIM) card interface
Two antenna connectors

The MU739 module is soldered onto the interface board in a manner that is similar to the surface mounting of chips. The signals output from the module are transferred to the development board for secondary development.

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Form Factor
LGA
Primary Technology
HSPA+
External Voltage
Yes
Interface to host
mini USB port
UMTS Bands
B1 (2100)
B2 (1900)
B8 (900)
B26 (850)
AWS
GNSS
No
Max DL Speed
21 Mbps
MIMO (Multiple-Input Multiple-Output)
No
Data Interface
Serial / UART
GPIO
USB 2.0
Max UL Speed
5.76 Mbps
Antenna Connectors
SMA
Driver Support
Android
Linux
Size
20x20x2 mm
This document describes how electrostatic discharge (ESD) occurs, how to conduct ESD tests, how interfering signals resulted from ESD are coupled to circuits of electronic devices, and what rules need to be followed during ESD design for Huawei LGA modules. Following these rules can provide users with good ESD performance during applications of Huawei LGA modules.

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This document describes the rules and precautions of designing Printed Circuit Board (PCB) interconnection for the HUAWEI LGA module. By observing the rules, users can ensure the performance of this module in use and reduce costs effectively.

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This document provides instructions for storage, packing, SMT assembly, and rework of the HUAWEI LGA module, and serves as a guide to secondary assembly of the HUAWEI LGA module. Meanwhile, this document provides PCB design guide for module assembly requirements of producibility and maintainability
The HUAWEI LGA module has two types of packaging:

PCB145-3030M: 145 pin LGA with a dimension of 30 mm × 30 mm
PCB114-3020M: 114 pin LGA with a dimension of 30 mm × 20 mm

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This document describes the Huawei MU739 Developer Board and how to use it during test and evaluation of Huawei MU739.

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Uploaded at
2012-07-02 20:24:29
Last updated
2015-09-24 19:44:04
Version
01
Related products
Huawei MU739
Huawei MU739 LGA Development Kit
Firmwareupdater for WIndows that upgrades the module to FW version 11.102.15.02.00. Release notes are included in the package.

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Uploaded at
2013-09-02 17:48:33
Last updated
2015-09-24 19:17:52
Version
11.102.15.02.00
Related products
Huawei MU739 LGA Development Kit
Huawei MU739