TECHSHIP IS A GLOBAL SUPPLIER OF WIRELESS COMPONENTS
Huawei MU739 is one of the world's slimmest and most compact 3G/HSPA+ modules. It has a 114-pin LGA connector and features an USB interface, JTAG and is hardware prepared for IPC and I2S Digital Voice.
The LGA package provides an ultra low profile in the integrated solution which is enhancing the performance of mechanical resistance to shock, reducing cost in high volume applications while also saving space and weight in portable devices.
The module support the HSPA+ network with a download speed up to 21 Mbps, satisfying consumer demand for high speed surfing. The MU739 support UMTS 5-band global roaming and is slimmer and smaller compared with HSPA+ modules on the market, while consuming less power and emitting less heat. The MU739 module can be integrated into a wide range of PC and CE products, including notebooks, smart phones, tablet computers, e-books, navigation devices, and PDAs.
The MU739 is also suitable for M2M and other embedded applications.
This document describes how electrostatic discharge (ESD) occurs, how to conduct ESD tests, how interfering signals resulted from ESD are coupled to circuits of electronic devices, and what rules need to be followed during ESD design for Huawei LGA modules. Following these rules can provide users with good ESD performance during applications of Huawei LGA modules.
This document describes the rules and precautions of designing Printed Circuit Board (PCB) interconnection for the HUAWEI LGA module. By observing the rules, users can ensure the performance of this module in use and reduce costs effectively.
This guide instructs the kernel driver integration development for Huawei Modules based on Embedded Linux & Android operating system. It is intended for the driver developers of the products based on Embedded Linux & Android OS.
This document provides instructions for storage, packing, SMT assembly, and rework of the HUAWEI LGA module, and serves as a guide to secondary assembly of the HUAWEI LGA module. Meanwhile, this document provides PCB design guide for module assembly requirements of producibility and maintainability
The HUAWEI LGA module has two types of packaging:
PCB145-3030M: 145 pin LGA with a dimension of 30 mm × 30 mm
PCB114-3020M: 114 pin LGA with a dimension of 30 mm × 20 mm
This document describes the AT command interface specification that is supported by Huawei terminal product MU739 module. This document describes certain AT commands (implemented by terminal devices) of international standards such as 3GPP TS 27.007 3d0, 3GPP TS 27.005 320, and ITU-T V.250 according to the requirements of terminal devices. In addition, this document describes the proprietary AT command interfaces that are implemented by terminal devices. These proprietary AT command interfaces help implement a certain function.
This document does not describe the interfaces that have been defined by standards or implemented by the mobile terminal (MT) but are not required by the MU739. The description of AT command interfaces covers only the data packets of interfaces and the methods and processes for the terminal equipment (TE) and the MT to use interfaces, excluding the contents that are not directly related to interfaces. In addition, this document describes only the AT command interfaces falling within the range of Rm interfaces between the TE and MT, excluding the AT command interfaces falling within the range of Um interfaces between the MT and Interworking Function.
The Ulog is a log capturing tool for all Huawei modules.
It can work on PCs and various embedded platforms, and supports different operating systems (OS), such as Windows 7, Linux, and Android.
For Windows there's a graphical user interface available. In order to capture logs with Ulog the modules unique shell lock code need to be acquired based on the IMEI.
Connection management software for use in Windows with Huawei Device wireless modules.
Firmwareupdater for WIndows that upgrades the module to FW version 11.102.15.02.00. Release notes are included in the package.